JPH047367B2 - - Google Patents

Info

Publication number
JPH047367B2
JPH047367B2 JP14278484A JP14278484A JPH047367B2 JP H047367 B2 JPH047367 B2 JP H047367B2 JP 14278484 A JP14278484 A JP 14278484A JP 14278484 A JP14278484 A JP 14278484A JP H047367 B2 JPH047367 B2 JP H047367B2
Authority
JP
Japan
Prior art keywords
weight
parts
solder resist
component
polymaleimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14278484A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6121132A (ja
Inventor
Fujitoshi Mizumoto
Yoneji Sato
Toshio Sugimoto
Kaoru Kanayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Asahi Chemical Laboratory Co Ltd
Original Assignee
Mitsubishi Petrochemical Co Ltd
Asahi Chemical Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Petrochemical Co Ltd, Asahi Chemical Laboratory Co Ltd filed Critical Mitsubishi Petrochemical Co Ltd
Priority to JP14278484A priority Critical patent/JPS6121132A/ja
Publication of JPS6121132A publication Critical patent/JPS6121132A/ja
Publication of JPH047367B2 publication Critical patent/JPH047367B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP14278484A 1984-07-10 1984-07-10 ソルダ−レジスト用樹脂組成物 Granted JPS6121132A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14278484A JPS6121132A (ja) 1984-07-10 1984-07-10 ソルダ−レジスト用樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14278484A JPS6121132A (ja) 1984-07-10 1984-07-10 ソルダ−レジスト用樹脂組成物

Publications (2)

Publication Number Publication Date
JPS6121132A JPS6121132A (ja) 1986-01-29
JPH047367B2 true JPH047367B2 (en]) 1992-02-10

Family

ID=15323517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14278484A Granted JPS6121132A (ja) 1984-07-10 1984-07-10 ソルダ−レジスト用樹脂組成物

Country Status (1)

Country Link
JP (1) JPS6121132A (en])

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6466228A (en) * 1987-09-08 1989-03-13 Mitsubishi Petrochemical Co Thermosetting resin composition
JP2715853B2 (ja) * 1992-08-03 1998-02-18 昭和高分子株式会社 銅張り積層板の製造方法
KR101670087B1 (ko) 2010-03-24 2016-10-28 삼성전기주식회사 열경화성 수지, 이를 포함한 수지 조성물, 및 이를 이용하여 제조된 인쇄회로기판
JP7360630B2 (ja) * 2018-02-28 2023-10-13 三菱瓦斯化学株式会社 化合物、樹脂、組成物及びそれを用いたリソグラフィー用膜形成材料

Also Published As

Publication number Publication date
JPS6121132A (ja) 1986-01-29

Similar Documents

Publication Publication Date Title
EP0009645B1 (en) 5-(2,5-diketotetrahydrofuryl)-3-methyl-3-cyclohexene-1,2-dicarboxylicanhydride, its use as curing agent for epoxy resins and as raw material for the production of polyimides, epoxy resins containing it, and their use in the preparation of various articles, and powder coating compositions
TWI240745B (en) Adhesive resin composition
EP0434013B1 (en) Epoxy resin-impregnated glass cloth sheet having adhesive layer
KR20030034106A (ko) 에폭시 수지 조성물 및 그의 경화물
US4460718A (en) Epoxy resin composition
JP2002293933A (ja) アルコキシ基含有シラン変性ポリアミック酸樹脂組成物およびポリイミド−シリカハイブリッド硬化物
TWI739976B (zh) 含烯基之樹脂、硬化性樹脂組成物及其硬化物
US20120097437A1 (en) Resin Composition, and Prepreg and Printed Circuit Board Prepared Using the Same
CN108774426A (zh) 一种高性能表面贴装油墨及其制备方法
JPH047367B2 (en])
CN103834343B (zh) 一种柔性覆铜板用环氧树脂胶粘剂及其制备方法
WO2016017746A1 (ja) エポキシ樹脂含有ワニス、エポキシ樹脂組成物含有ワニス、プリプレグ、樹脂シート、積層板、プリント配線基板、半導体装置
KR19980079256A (ko) 폴리이미드 전구체 용액, 이의 제조방법, 이러한 용액으로부터 수득한 피막 또는 필름 및 필름의 제조방법
CN104531024A (zh) 环氧树脂胶粘剂及该胶粘剂制备的柔性覆铜板及制备方法
CN112694714A (zh) 环氧树脂组合物、预浸料、层压板及印刷电路板
JPH0812914A (ja) ポリイミドインキ
JPS61180236A (ja) ソルダ−・レジスト用樹脂組成物
CN105542161B (zh) 一种阻燃氰酸酯树脂及其制备方法
JPH021789A (ja) 電気回路板
CN110951235B (zh) 一种甲基丙烯酸酯聚苯醚树脂及其制备方法和应用
JP6932116B2 (ja) エポキシ樹脂含有ワニス、エポキシ樹脂組成物含有ワニス、プリプレグ、樹脂シート、プリント配線板、半導体装置
JP4171952B2 (ja) 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板
US8846790B2 (en) Resin composition, and prepreg and printed circuit board prepared using the same
JP2000086742A (ja) エポキシ樹脂組成物及び導電性ペースト
JP3324667B2 (ja) 金属張積層板用エポキシ樹脂組成物、および金属張積層板の製造方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term